Curing Behavior of Poly(silicon alkyne imide) Resin

The curing behavior of poly(silicon-alkyne imide) (PSI) resin, which is prepared by copolymerizing polyimide (ATPI) designed by a material genome approach and silicon-containing arylacetylene (PSA), has been studied to meet the need of application study and property assessment of PSI resin. The characterization of molecular structure, differential scanning calorimetry (DSC) test, the analysis of the curing kinetics and rheological behavior for PSI resin were carried out and the curing processing of PSI resin was determined. The results indicate that PSI resin is cured by the reaction of alkynyl groups at the molecular of the copolymer according to infrared spectroscopy (IR) analysis and thermogravimetric (TG) analysis of PSI resin prior to and after curing. The initial reaction temperature and reaction enthalpy are relatively high when PSI resin is cured and the reaction heat is released at a relatively small temperature range. The activation energy, frequency factor and reaction order from analysis of the cure kinetics for the PSI resin curing reaction are 83.2 kJ/mol, 5.0×10¹² s⁻¹ and 0.93, respectively. The curing processing of the PSI resin is initially determined to be 160 ℃, 3 h→190 ℃, 2 h→220 ℃, 2 h→250 ℃, 4 h.