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    苯乙炔基酰亚胺功能化苯并噁嗪树脂的制备及其热性能

    Preparation and Thermal Properties of Phenyl-ethynyl-functionalized Phthalimide-based Benzoxazine Resin

    • 摘要: 本研究设计并合成了4种苯乙炔基邻苯二甲酰亚胺功能化苯并噁嗪单体。通过调控邻苯二甲酰亚胺在苯并噁嗪芳环上的键接位点与噁嗪环N-位取代基结构,研究分子结构对单体热聚合行为及固化树脂性能的影响。采用核磁共振氢谱(1H-NMR)、核磁共振碳谱(13C-NMR)及傅里叶变换红外光谱(FT-IR)对单体结构进行表征,并借助差示扫描量热法(DSC)、固化动力学和原位红外(In-situ FT-IR)分析其热聚合行为。结果显示,2-3-(呋喃-2-基甲基)-3,4-二氢-2H-苯并e1,3噁嗪-8-基-5-(苯乙炔基)异吲哚啉-1,3-二酮(oPP-pe-fa)表现出最低的固化峰温度(227 ℃);结合表观活化能及原位红外分析证实,邻苯二甲酰亚胺连接位置和噁嗪环N-位侧链结构均会影响单体的热聚合行为,且噁嗪环开环和内炔基反应均参与固化过程。进一步通过热重分析(TGA)评价固化树脂的热稳定性,所有苯并噁嗪树脂均具备优异的热稳定性,且热性能随分子结构差异明显分化,其中含双炔基结构的单体2-3-(3-乙炔基苯基)-3,4-二氢-2H-苯并e1,3噁嗪-8-基-5-(苯乙炔基)异吲哚啉-1,3-二酮(oPP-pe-ma)聚合后表现出最优热稳定性。通过垂直燃烧试验(UL-94)对阻燃性能进行了进一步评估,结果显示,poly(oPP-pe-ma)的UL-94测试结果为V-0级。综上,邻苯二甲酰亚胺连接位置及噁嗪环N-位取代基结构对该类苯并噁嗪的热聚合行为和固化树脂性能具有显著影响,为构筑高耐热苯并噁嗪热固性树脂提供分子设计思路。

       

      Abstract: Four phenylethynyl-phthalimide-functionalized benzoxazine monomers were designed and synthesized. By adjusting the attachment position of phthalimide on the aromatic ring of benzoxazine and the substituent structure at the nitrogen site of the oxazine ring, the effects of molecular structure on the thermal-polymerization behavior of monomers and the properties of cured resins were investigated. The chemical structures of the monomers were characterized by Proton Nuclear Magnetic Resonance(1H-NMR), Carbon-13 Nuclear Magnetic Resonance(13C-NMR) and Fourier-transform infrared spectroscopy (FT-IR). Differential scanning calorimetry (DSC), curing-kinetics analysis and in-situ FT-IR were employed to explore their thermal-polymerization behaviors. The results demonstrated that 2-(3-(furan-2-ylmethyl)-3,4-dihydro-2H-benzo e1,3 oxazin-8-yl)-5-(phenylethynyl) isoindoline-1,3-dione (oPP-pe-fa) possessed the lowest curing-peak temperature (227 ℃). Combined with the apparent-activation-energy results and in-situ FT-IR spectra, both the phthalimide attachment position and the N-side-chain structure could affect the thermal-polymerization behavior of monomers. Moreover, both the ring-opening reaction of oxazine rings and ethynyl-group reaction participated in the curing process. Furthermore, thermogravimetric analysis (TGA) was carried out to evaluate the thermal stability of cured resins. All benzoxazine resins possessed excellent thermal stability whereas obvious discrepancies existed among samples with different molecular structures. Among them, poly(2-(3-(3-ethynylphenyl)-3,4-dihydro-2H-benzo e1,3 oxazin-8-yl)-5-(phenylethynyl) isoindoline-1,3-dione) (poly(oPP-pe-ma)) containing a di-ethynyl structure exhibited optimal thermal stability and a char yield of 72 %. The flame-retardant performance was further assessed by the UL-94 vertical burning test, and poly(oPP-pe-ma) reached a UL-94 V-0 rating. These findings reveal that the phthalimide attachment position and N-substituent structure on the oxazine ring exert remarkable influences on the thermal-polymerization behavior of this kind of benzoxazine as well as the performance of cured resins, which provides a reference for the molecular-structure design of high-heat-resistant benzoxazine thermosetting resins.

       

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