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    低黏度聚硅炔酰亚胺树脂及其复合材料的制备与性能

    Preparation and Performance of Low Viscosity Poly(silicon-alkyne imide) Resins and Their Composites

    • 摘要: 以4,4'-氧双邻苯二甲酸酐(ODPA)、1,3-双(4-氨基苯氧基)苯(1,3,4-APB)、3-氨基苯乙炔(APA)为原料合成了乙炔基封端的聚酰亚胺(PI)。利用傅里叶变换红外光谱和核磁共振氢谱对PI的结构进行了表征。通过将PI与含硅芳炔(PSA)树脂进行共聚反应,成功合成了聚硅炔酰亚胺(PSI)树脂。通过旋转流变仪分析了PSI树脂的流变行为,PI质量分数为10%的PSI树脂(PSI-10)熔体黏度小于1 Pa·s的温度区间为98~187 ℃,在110 ℃下可维持黏度小于1 Pa·s的时间超过6 h,符合树脂传递模塑成型(RTM)工艺的要求。通过差示扫描量热法(DSC)对PSI树脂的热固化特性进行深入研究,并据此设计固化工艺。同时,利用热重分析(TGA)对PSI树脂的热稳定性进行了评估。对于PSI-10树脂的固化产物,其在失重5%时的热分解温度(Td5)为602 ℃,而在800 ℃时的残碳率(Yr800)高达89.8%。用万能试验机测得PSI-10树脂固化物的弯曲强度为34.0 MPa,比纯PSA树脂提升了64%。石英纤维增强PSI-10复合材料的弯曲强度和层间剪切强度(ILSS)分别为340 MPa和23.0 MPa,力学性能较好。这是因为PI的引入使得树脂的韧性提高,同时也提高了树脂与增强材料的黏结性能。

       

      Abstract: Silicon-containing arylacetylene (PSA) resin holds great promise for applications in the aerospace industry, attributed to its outstanding heat resistance. However, lacking of toughness after curing limits its applications. Polyimide resin combines high heat resistance and high mechanical properties, which can be used to modify PSA resin. The idea of copolymerizing polyimide and PSA is proposed to prepare a novel resin with better comprehensive properties. Ethynyl-terminated polyimide (PI) was synthesized from 4,4'-oxydiphthalic anhydride (ODPA), bis(4-aminophenoxy)benzene (1,3,4-APB), and 3-aminophenylacetylene (APA). The structure of PI was characterized by infrared spectroscopy and nuclear magnetic resonance hydrogen spectroscopy. Poly(silicon-alkyne imide) (PSI) resin was synthesized through the copolymerization of PI with PSA resin. The rheological properties of the PSI resin were examined using a rotational rheometer. The temperature range of PSI-10 (w(PI)=10%) resin melting viscosity less than 1 Pa·s was 98~187 ℃, and the viscosity less than 1 Pa·s can be maintained for more than 6 h at 110 ℃, which could meet the requirements of resin transfer molding (RTM) process. The curing characteristics of the PSI resin were investigated using differential scanning calorimetry, which allowed for the determination of its curing process. Thermogravimetric analysis was employed to assess the thermal stability of PSI resin, revealing that the 5% mass loss thermal decomposition temperature (Td5) and the residual carbon rate at 800 ℃ (Yr800) for the PSI-10 resin were 602 ℃ and 89.8%, respectively. The flexural strength of the PSI resin, as determined by a universal testing machine, was 34.0 MPa, a 64% increase compared to that of the pure PSA resin. Quartz fiber-reinforced PSI-10 composite demonstrated superior mechanical properties with a flexural strength of 340 MPa and an interlaminar shear strength (ILSS) of 23.0 MPa. This enhancement in mechanical performance is attributed to the addition of PI, which not only enhances the resin's toughness but also strengthens the interfacial adhesion between the resin and the reinforcing material.

       

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