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    高万星, 宋宁, 倪礼忠. 双(N-间乙炔基苯基邻苯二甲酰亚胺)醚改性苯乙炔基硅氧硼烷[J]. 功能高分子学报, 2011, 24(1).
    引用本文: 高万星, 宋宁, 倪礼忠. 双(N-间乙炔基苯基邻苯二甲酰亚胺)醚改性苯乙炔基硅氧硼烷[J]. 功能高分子学报, 2011, 24(1).
    GAO Wan-xing, SONG Ning, NI Li-zhong. Characterization of Phenylethynyl Siloxane Borane Modified with Di((N-m-Acetylenylphenyl) Phthalimide)Ether[J]. Journal of Functional Polymers, 2011, 24(1).
    Citation: GAO Wan-xing, SONG Ning, NI Li-zhong. Characterization of Phenylethynyl Siloxane Borane Modified with Di((N-m-Acetylenylphenyl) Phthalimide)Ether[J]. Journal of Functional Polymers, 2011, 24(1).

    双(N-间乙炔基苯基邻苯二甲酰亚胺)醚改性苯乙炔基硅氧硼烷

    Characterization of Phenylethynyl Siloxane Borane Modified with Di((N-m-Acetylenylphenyl) Phthalimide)Ether

    • 摘要: 用双(N-间乙炔基苯基邻苯二甲酰亚胺)醚(DAIE)改性苯乙炔基硅氧硼烷(PESB)制得复合材料基体树脂(PESBDAIE)。通过FT-IR、DSC和TG研究了PESBDAIE的固化反应及耐热性。将PESBDAIE与纤维复合制得复合材料,研究了该材料的耐热性、弯曲强度及断面形貌。研究结果表明,固化物在氮气气氛下质量损失5%时的温度(T5%)为576 °C,空气气氛下T5%为507 °C。复合材料在500 °C下放置10 min后质量保留率为97.0%,弯曲强度为176 MPa。

       

      Abstract: Phenylethynyl siloxane borane (PESB) was modified with di((N-m-acetylenylphenyl) phthalimide) ether (DAIE) and used as the matrix resin of composite. The curing mechanism and heat resistance were studied with FT-IR, DSC and TG. The flexural strength, heat resistance and fracture surface of the composites were also studied. Results showed that the temperature of 5% weight loss (T5%) of the cured blends was 576 °C in nitrogen and 507 °C in air. The mass retention of the composites after placed in 500 °C environment for 10 min was 97.0%, and the flexural strength was 176 MPa.

       

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