Abstract:
The siliconcontaining poly(arylaeetylene) resin (GMD) was synthesized by condensation reaction. The curing the cured GMD was 631°C in nitrogen. The residual of mass was 59% based on the initial mass at 1 000 °C. The flexural the cured GMD was 631°C in nitrogen. The residual of mass was 59% based on the initial mass at 1 000 °C. The flexural strength at room temperature of the composite was 324 MPa and the retention rate of flexural strength was 90% at 240 °C. After heat treated for 7 min at 500°C in air, the retain ratio of the composite was 99.7%. The composite of which Tg was more than 400 °C possessed excellent high temperatureresistance properties, excellent mechanical and dielectric properties.