Abstract: As the electronics field is increasingly developing in the direction of high-speed transmission and high connection density, the copper clad laminates widely used in 5G equipment have technical requirements such as low dielectric constant, low dielectric loss, high thermal conductivity, high reliability, et al. Polytetrafluoroethylene (PTFE) copper clad laminates are widely used in high-frequency microwave circuits because of their excellent dielectric properties and chemical stability. However, the preparation of existing PTFE copper clad laminates has related problems in the whole chain of monomer purification, resin polymerization, filler modification, composite materials to product processing, which limits their practical applications. This paper summarizes the development process of copper clad laminates in recent years, and proposes methods to solve the performance of PTFE from the aspects of molecular design and sequence distribution control of high cohesive PTFE, controllable impurity content of the whole process of high purity PTFE and green industrialization technology, new filler preparation and surface treatment technology, composition and interface design of multi-phase and multi-component PTFE composite materials, processing rheology and structural uniformity control of copper clad laminates, etc., so as to develop a system basic theory from the aspects of resin structure, filler modification, composite to molding processing, and the preparation of high-performance PTFE copper clad laminate.